| Katana Silicon Technologies |
Semiconductor devices manufacturing technology, Nonvolatile Memory, MRAM, Semiconductor Packaging, Power Saving |
| L2 Mobile Technologies |
3G/LTE cellular technology |
| Lone Star Silicon Innovations |
Semiconductor devices manufacturing technology |
| Nordic Interactive Technologies |
Mobile and video codec technologies, HEVC |
| Ox Mobile Technologies |
LTE cellular technology |
| Carthage Silicon Innovations |
Memory Technology, CMOS Image Sensor and Semiconductor devices manufacturing Technology |
| Trenchant Blade Technologies |
Semiconductor Technology |
| Nyckel UI Technologies |
IoT, 5G NR and MTC technologies |
| Hannibal IP |
5G wireless technologies |
| Hamilcar Barca IP |
Computer Architecture, Semiconductor devices manufacturing technology, Microprocessors, Power Saving |
| Dido Wireless Innovations |
5G wireless technologies |
| Hermes IP Management |
Mobile Device Technologies |
| Hasdrubal IP |
Memory Design, Circuit Design Technologies, Semiconductor Fabrication Technologies |
| Mago Barca IP |
Semiconductor Manufacturing, Advanced Packaging Technologies, TSV Innovations |
| Byrsa IP |
Human Proximity Detection, LiDAR Systems |
| Antoninus Thermal Management |
3D Chip Manufacturing, Thermal Management, Packaging Technologies |
| Eshmun IP |
Wireless Charging, Multi‑Device Charging and Intelligent Power Allocation, Impedance Matching |
| Hanno IP |
Smart security and surveillance, Mobile imaging and computational photography, Robotics and autonomous systems, VR/AR and immersive media, Cloud video analytics, Edge‑AI devices, Automotive surround‑view systems, Drone imaging and mapping |
| Utica IP |
e-gifting, digital gift creation, secure transmission, authentication, redemption, user interface presentation, transaction processing, and cross-platform delivery of electronic gift items and monetary-value digital assets |
| Green Mountain Memory Technologies |
Compute‑in‑memory Neural processing, DRAM‑based AI acceleration, Content‑addressable and parallel‑search memory, Reconfigurable fault‑tolerant/ECC memory architectures, Embedded neural activation/topology mechanisms inside standard memory arrays |